金盘科技(688676.SH)发行可转债申请获上交所审议通过

Core Viewpoint - Jinpan Technology (688676.SH) has received approval from the Shanghai Stock Exchange's Sci-Tech Innovation Board for its application to issue convertible bonds to unspecified investors, meeting all necessary conditions for issuance and listing [1] Group 1 - The Shanghai Stock Exchange's Sci-Tech Innovation Board held its 51st listing committee meeting on November 7, 2025 [1] - The review concluded that Jinpan Technology's application for issuing convertible bonds complies with issuance conditions, listing conditions, and information disclosure requirements [1]