帝尔激光：公司的TGV激光微孔设备，目前已经完成面板级玻璃基板通孔设备的出货

Core Viewpoint - The company has achieved comprehensive coverage of TGV packaging laser technology for both wafer-level and panel-level glass substrates, indicating significant advancements in its laser micro-hole equipment [1] Group 1: Company Developments - The company has completed the shipment of panel-level glass substrate through-hole equipment, marking a milestone in its TGV laser micro-hole technology [1] - The company's PCB business is focusing on the development of ultrafast laser drilling technology, with ongoing engagements with 2 to 3 clients [1] - Prototypes of the ultrafast laser drilling equipment are currently in the trial production phase [1]