【资本】一IC载板企业完成数千万元融资

Group 1 - Company X completed several million yuan Series A financing led by existing shareholder Zhongshan Investment Control Group, with funds primarily aimed at mass production and capacity expansion of high-density flip chip substrates [1] - Company X specializes in integrated circuit packaging substrate solutions, focusing on the design, research and development, and mass production of high-end chip packaging substrates, with a core management team having over 20 years of experience in packaging technology [1] - The company has developed advanced substrate processing technologies, including mSAP, ETS, and SAP, and has achieved production capabilities for FCCSP and FCBGA substrates with line width/spacing of 10/10μm [1] Group 2 - Company Y, Jiangsu Punowei Electronics Co., Ltd., was recognized as a "near-zero carbon factory" in Suzhou, indicating its commitment to greenhouse gas management and emission reduction [3] - Established in 2004, Company Y focuses on integrated circuit packaging substrate manufacturing and has made significant technological breakthroughs, holding nearly 75 authorized patents [3] - Company Y has implemented comprehensive quality management and has received various certifications, including quality, environmental, occupational health and safety, and energy management systems [3]