封测龙头来了，连亏之下，芯德半导体能否获青睐？

Core Viewpoint - The semiconductor sector in the Hong Kong stock market has experienced significant growth this year, with companies like Huahong Semiconductor and Shanghai Fudan seeing substantial stock price increases [1][2]. Group 1: Market Performance - The semiconductor sector in Hong Kong has seen a surge, with Huahong Semiconductor (01347.HK) rising over 260%, and Shanghai Fudan (01385.HK), InnoCare (02577.HK), and SMIC (00981.HK) also increasing by more than 130% [1]. - More semiconductor companies are entering the Hong Kong market, with Jiangsu Xinde Semiconductor Technology Co., Ltd. recently submitting its prospectus for a mainboard listing [2]. Group 2: Company Overview - Jiangsu Xinde Semiconductor focuses on advanced packaging technology and has accumulated extensive experience since its establishment in September 2020, covering various packaging types such as QFN, BGA, LGA, WLP, and 2.5D/3D [3][4]. - The company has established a comprehensive technology platform for advanced packaging, known as CAPiC, to continuously develop cutting-edge technologies [4]. Group 3: Client Base and Investments - Xinde Semiconductor has built a diverse client base in key chip areas, including major companies like MediaTek, Amlogic, and Broadcom [4]. - The company has received investments from various sources, including local state-owned assets and well-known institutions, with notable shareholders including Xiaomi and OPPO [4]. Group 4: Financial Performance - Xinde Semiconductor has reported continuous losses, with revenues projected to be RMB 269 million in 2022, increasing to RMB 475 million in the first half of 2025, while losses are expected to remain significant [5][6]. - The adjusted net losses for the same period are projected to decrease from RMB 301 million in 2022 to RMB 111 million in the first half of 2025 [5][6]. Group 5: Revenue Structure and Risks - The revenue structure is relatively balanced among different product lines, with QFN, BGA, LGA, and WLP contributing 31.0%, 31.8%, 20.1%, and 16.9% respectively in the first half of 2025 [6]. - The company relies heavily on a few major clients, with the top five clients accounting for approximately 60.5% of total revenue in 2022 [7][8]. Group 6: Financing and Future Plans - Xinde Semiconductor has seen an increase in financing costs, with bank borrowings rising from RMB 384 million in 2022 to RMB 824 million in the first half of 2025 [9]. - The company plans to use the funds raised from its IPO for building production facilities, enhancing R&D capabilities, and expanding its customer collaboration ecosystem [9].