首次发债！河南创新投资集团拟发行5亿元科技创新债券

Core Points - Henan Innovation Investment Group Co., Ltd. plans to issue its first phase of technology innovation bonds for 2025, with a total amount of 500 million yuan and a term of 5 years [1] - The bond issuance period is from November 13 to November 14, 2023, with an interest start date of November 17, 2025, and a maturity date of November 17, 2030 [1] - The main underwriter for the bonds is Shanghai Pudong Development Bank, with China Industrial and Commercial Bank as the co-underwriter [1] - The issuer has received a comprehensive credit rating of AAA from China Chengxin International, with a stable outlook [1] - The funds raised will be used entirely to replace the issuer's own capital invested in technology innovation-related funds within the past year [1] Fund Allocation - The funds will be allocated to various investment projects, including biomedicine, new materials, advanced manufacturing, and new consumption [1] - Specific funds mentioned include the Henan Provincial Strategic Emerging Industry Investment Fund and the Henan Huirong Venture Capital Fund, among others [1] - The total amount raised from this bond issuance is 500 million yuan, which will be distributed across several investment areas [1] Company Background - Henan Innovation Investment Group was established in September 2022, with a registered capital of 20 billion yuan, and is a key state-owned technology investment institution in Henan Province [1] - The company is responsible for the investment operation of emerging industry investments and venture capital guiding funds in Henan Province [1] - This bond issuance marks the company's first foray into bond issuance [1]