CFMEE(SH:688630) Xin Lang Cai Jing·2025-11-10 10:20Group 1 - The company reported a revenue of 934 million yuan for the first three quarters of 2025, representing a year-on-year increase of 30.03% [1] - The net profit attributable to shareholders reached 199 million yuan, up 28.20% year-on-year, while the net profit excluding non-recurring items was 193 million yuan, reflecting a 30.45% increase [1] - In Q3 2025, the company achieved a revenue of 279 million yuan, a year-on-year growth of 3.98% but a quarter-on-quarter decline of 32.25% [1] Group 2 - The company's gross margin in Q3 2025 was 42.15%, an increase of 2.64 percentage points year-on-year, while the net profit margin was 20.34%, up 0.08 percentage points year-on-year [1] - The company has focused on production assurance, product development, and expanding overseas markets, contributing to the growth in profitability [1] - The company’s expenses in Q3 2025 showed varied changes, with sales, management, R&D, and financial expense ratios at 7.64%, 3.65%, 9.82%, and -1.84% respectively, indicating a mix of increases and decreases in expense ratios [1] Group 3 - The AI industry is driving a recovery in the PCB sector, with a projected 46% year-on-year increase in global AI server shipments in 2024 [3] - The company has been operating at full capacity since March 2025, with a record monthly shipment exceeding 100 units [3] - The company is expanding its global strategy, particularly in Southeast Asia, with significant revenue contributions from its operations in Thailand and strong order growth in emerging markets like Vietnam and Malaysia [3] Group 4 - The company maintains a "buy" rating, anticipating continued growth in the PCB market driven by AI technology and electric vehicle demand [4] - Future net profits are projected to be 278 million yuan, 455 million yuan, and 601 million yuan for 2025, 2026, and 2027 respectively, with corresponding EPS estimates of 2.11, 3.45, and 4.56 yuan per share [4] - The company is expected to benefit from the demand for HPC and advanced packaging in its semiconductor business [4]