中兴通讯公布国际专利申请：“差分过孔结构、焊球阵列封装组件、印刷电路板及通信设备”

Core Insights - ZTE Corporation has filed an international patent application titled "Differential Through Hole Structure, Solder Ball Array Packaging Component, Printed Circuit Board and Communication Equipment" with application number PCT/CN2025/083454, which is set to be published internationally on November 6, 2025 [1] Group 1 - ZTE has announced a total of 941 international patent applications this year, representing a decrease of 12.3% compared to the same period last year [4] - In the first half of 2025, ZTE invested 12.665 billion yuan in research and development, which is a slight decrease of 0.48% year-on-year [4]