SMIC(SH:688981) Chan Ye Xin Xi Wang·2025-11-11 01:16Core Insights - The Chinese electron beam lithography (EBL) system industry is transitioning from "catching up" to "keeping pace" with international standards, achieving breakthroughs in technology such as 0.6 nm resolution and a production capacity of 60 wafers per hour, nearing global advanced levels [1][7][11] - The market size of the Chinese EBL system industry is projected to reach approximately 294 million yuan in 2024, representing a year-on-year growth of 59.78% [1][8] - Despite advancements, the industry faces challenges such as insufficient domestic production of EUV photoresists (less than 1%) and technical hurdles in processes below 2 nm [1][5][14] Industry Overview - EBL systems utilize high-energy electron beams for nanoscale structure fabrication, offering advantages like ultra-high resolution (less than 10 nm) and flexibility without masks, widely applied in semiconductor manufacturing and quantum device preparation [2][3] - The upstream supply chain includes materials like high-purity quartz glass and photoresists, while the downstream applications focus on semiconductor manufacturing and research [3][4] Market Size - The Chinese EBL system market is expected to grow significantly, with a forecasted market size of 294 million yuan in 2024, marking a 59.78% increase from the previous year [1][8] - The domestic demand for semiconductor chips continues to rise, driven by emerging technologies such as 5G and AI, which further supports the growth of the EBL system market [7][12] Key Companies and Institutions - Notable advancements have been made by companies like Zeyou Technology and Zhejiang University, with the "Xizhi" EBL machine achieving 0.6 nm precision and 8 nm linewidth technology, marking significant progress in domestic capabilities [8][11][9] - Zeyou Technology's EBL system has achieved over 95% localization rate and is being applied in various high-tech fields, breaking the monopoly of foreign companies [9][10] Industry Development Trends 1. Technological Breakthroughs: The focus will be on achieving resolutions below 0.6 nm and enhancing multi-beam parallel technology, with the aim of increasing production capacity to 120 wafers per hour [11][12] 2. Expanding Market Demand: The demand for high-precision chips in sectors like quantum computing and advanced packaging is expected to surge, driven by government support and industry collaboration [12][14] 3. Complete Supply Chain Development: The industry aims to achieve self-sufficiency across the entire supply chain, enhancing the localization of critical materials and addressing challenges in EUV photoresist production [14]