东微半导跌2.25% 2022年上市超募10.7亿元

Group 1 - Dongwei Semiconductor (688261.SH) closed at 66.91 yuan, with a decline of 2.25% [1] - The company was listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board on February 10, 2022, issuing 16.844092 million shares, accounting for 25.00% of the total shares post-issuance, at a price of 130.00 yuan per share [1] - Currently, the stock is in a state of decline from its initial offering price [1] Group 2 - The total funds raised by Dongwei Semiconductor during its IPO amounted to 2.19 billion yuan, with a net amount of 2.007 billion yuan after deducting issuance costs, which was 1.068 billion yuan more than the original plan of 939 million yuan [1] - The funds are intended for upgrading and industrialization of super junction and shielding gate power devices, R&D of new structure power devices, and construction of a research and development engineering center [1] - The total issuance costs were 183 million yuan, with the lead underwriter, China International Capital Corporation, receiving 156 million yuan in underwriting fees [1] Group 3 - The company announced a cash dividend of 1.476 yuan per share (including tax) and a capital reserve transfer of 0.4 shares for every share held, resulting in a total cash dividend distribution of approximately 99.45 million yuan and a transfer of 26.95 million shares [2] - Following this distribution, the total share capital will increase to 94,326,914 shares [2] - For the 2023 annual dividend distribution, the company plans to distribute 1.79 yuan in cash for every 10 shares and transfer 3 shares for every 10 shares held, with the record date set for July 3, 2024 [2]