芯碁微装：公司CO₂激光钻孔设备可适用于HDI和IC载板的微盲孔加工

Core Viewpoint - The company has addressed concerns regarding the heat-affected zone in PCB laser drilling, ensuring high-quality processing and reducing risks associated with thermal accumulation [1] Group 1: Technology and Equipment - The company's laser drilling machine optimizes laser paths and coordinates motion control to minimize unnecessary movement and processing time, thereby reducing the risk of local thermal accumulation [1] - The equipment adjusts pulse repetition frequency based on scanning speed to maintain consistent high processing quality across all corners of the cut profile, effectively reducing thermal impact [1] - The CO₂ laser drilling equipment is suitable for micro-blind hole processing on HDI and IC substrates, characterized by high precision, quality, and efficiency [1]