CFMEE(SH:688630) Mei Ri Jing Ji Xin Wen·2025-11-11 10:58Core Viewpoint - The company has addressed concerns regarding the thermal impact zone in PCB laser drilling, which can lead to issues such as carbonization, cracks, and material performance degradation. The laser drilling equipment is also suitable for application on memory hard disk PCBs [2]. Group 1: Technology and Equipment - The company's laser drilling machine optimizes the laser path and coordinates the motion system to reduce unnecessary movement and processing time, thereby minimizing the risk of local heat accumulation [2]. - The equipment features the ability to adjust pulse repetition frequency based on scanning speed, ensuring consistent high processing quality across all corners of the cutting profile and reducing thermal impact [2]. - The quality of the drilled holes and the thermal impact zone has been recognized by major clients' process departments [2]. Group 2: Application and Features - The company's CO laser drilling equipment is suitable for micro-blind hole processing on HDI and IC substrates, characterized by high precision, high quality, and high efficiency [2].