青岛首单股权投资机构科技创新债券落地，省内率先实现科创债发行“三类主体”全覆盖

Core Points - Qingdao Chengtou Venture Capital Co., Ltd. successfully issued the first phase of technology innovation bonds for 2025, marking it as the first equity investment institution in Qingdao to issue such bonds [1] - The bond issuance scale is 500 million yuan, with a term of 5 years and a coupon rate of 2.23%, aimed at replacing fund contributions invested in technology innovation enterprises within one year [1] - Since the launch of the "technology board" in May, Qingdao has achieved full coverage of technology innovation bond issuance among three types of entities: technology enterprises, financial institutions, and equity investment institutions [1] Summary by Category Bond Issuance - The total issuance scale of technology innovation bonds in Qingdao has reached 5 billion yuan, with 2 technology enterprises, 2 financial institutions, and 1 equity investment institution successfully issuing bonds [1] - The issuance includes the first "green + two new" technology innovation bond in the national consumer industry and the first technology innovation financial bond for rural commercial banks in the country [1] - One technology enterprise has been approved for an additional bond registration quota of 7 billion yuan, and one private equity investment institution has a quota of 300 million yuan, both of which will issue bonds at an appropriate time [1] Future Plans - The People's Bank of China Qingdao Branch plans to further consolidate and expand the achievements of technology innovation bond development, enhance policy promotion efforts, and continuously explore and cultivate new bond issuers [2] - There will be a deepening of the collaboration mechanism among government, banks, and enterprises to expand the issuance scale of technology innovation bonds and improve the bond market's service efficiency for "technology finance" [2]