快克智能：公司热压键合设备（TCB）预计年内完成样机研发

Core Viewpoint - The company, 快克智能 (603203.SH), announced on November 12 that it expects to complete the prototype development of its thermal compression bonding (TCB) equipment by the end of the year [1]. Group 1 - The company is responding to investor inquiries regarding the development progress of its TCB equipment amid increasing demand for HBM (High Bandwidth Memory) equipment [3]. - The company is under pressure to accelerate the development and provide samples to customers [3].