成都银行公布170亿元发债计划含70亿元二级资本债

Core Viewpoint - Chengdu Bank has approved two significant bond issuance proposals during its recent board meeting, indicating a strategic move to enhance its capital structure and support financial operations [1] Group 1: Bond Issuance Proposals - The bank plans to issue 7 billion yuan in subordinated capital bonds with a 10-year maturity and a redemption option at the end of the fifth year [1] - A total of 10 billion yuan is planned for the issuance of special financial bonds and ordinary financial bonds, with a cap of 3 billion yuan for technology innovation bonds and 3 billion yuan for green financial bonds [1] - Both proposals will be submitted for shareholder meeting approval, with the final issuance plan subject to regulatory approval [1]