华源控股携手寰鼎达成战略合作 共推半导体设备自主化进程

Core Viewpoint - Suzhou Huayuan Holdings Co., Ltd. and Huanding Integrated Circuit (Shanghai) Co., Ltd. have officially reached a strategic cooperation intention and signed an investment intention agreement to enhance collaboration in the semiconductor equipment sector [1] Group 1: Strategic Cooperation - The partnership will focus on capital cooperation in core areas such as specialized auxiliary equipment for integrated circuits, rapid thermal processing equipment, packaging and testing equipment, as well as the R&D, manufacturing, and sales of related components and consumables [1] - The collaboration aims to promote the localization of manufacturing for semiconductor equipment, components, and consumables, thereby supporting technological upgrades and market expansion in the industry [1] Group 2: Advantages and Goals - Huayuan Holdings, as a listed company, will leverage its capital platform and market resource integration capabilities, while Huanding will focus on R&D and industrialization of semiconductor equipment and related products based on its technological foundation [1] - The cooperation is expected to empower the independent innovation and industrial development of domestic semiconductor equipment, injecting momentum into the high-quality development of the industry [1] Group 3: Future Development - With the support of Huayuan Holdings, Huanding will accelerate the R&D and mass production of next-generation thermal processing equipment, promoting the localization of integrated circuit packaging and testing equipment and consumables [1] - This partnership marks a significant step for Huanding in connecting with the capital market and collaborating within the industrial ecosystem, laying a solid foundation for its long-term development [1][2]