芯联集成：公司模拟IC芯片聚焦于持续开发高压、大功率、高密度的BCD工艺

Core Viewpoint - Company focuses on the continuous development of high-voltage, high-power, and high-density BCD process for analog IC chips, with accelerated customer adoption of high-voltage and integrated solution process platforms, currently covering over 70% of domestic design companies [1] Group 1 - Company is engaged in the development of analog IC chips [1] - Company emphasizes high-voltage, high-power, and high-density BCD process technology [1] - Customer adoption of high-voltage and integrated solution process platforms is accelerating [1] Group 2 - Company has achieved coverage of over 70% of domestic design companies [1]