Core Viewpoint - ChipLink Integrated (芯联集成) plans to increase capital by 1.8 billion yuan to its subsidiary ChipLink Pioneer (芯联先锋) to support the ongoing implementation of the "Phase III 12-inch integrated circuit analog mixed-signal chip manufacturing project" [2][5] Group 1: Capital Increase and Financial Tools - The capital increase will ensure that ChipLink Integrated maintains a controlling stake of at least 50.85% in ChipLink Pioneer after the investment [2] - The company intends to apply for a policy financial tool from the National Development Bank, not exceeding 1.8 billion yuan, with a term of 5 years [5] - The funds from the new policy financial tool will be injected as equity capital into ChipLink Pioneer for the aforementioned project, with ChipLink Yuezhou (芯联越州) providing joint liability guarantees [5] Group 2: Strategic Importance and Market Outlook - ChipLink Integrated and its subsidiary are recognized as national high-tech enterprises, and the chips produced will support various strategic emerging industries such as artificial intelligence, the Internet of Things, and new energy vehicles [10] - The capital increase aligns with the company's strategic development plan and market outlook for power module applications, leveraging the new policy financial tool to reduce overall financing costs [10] - The company reported a revenue of 3.495 billion yuan for the first half of 2025, a year-on-year increase of 21.38%, and a net profit attributable to shareholders of -170 million yuan, a year-on-year increase of 63.82% [11]

登录新浪财经APP 搜索【信披】查看更多考评等级 证券代码：688469 证券简称：芯联集成 公告编号：2025-053 基于新型政策性金融工具的落实和推进的契机，为了保障"三期12英寸集成电路数模混合芯片制造项 目"的持续实施，公司拟向国家开发银行全资子公司国开新型政策性金融工具有限公司申请不超过人民 币18亿的政策性金融工具，期限为5年。新型政策性金融工具资金将通过权益性资金注入芯联先锋作 为"三期12英寸集成电路数模混合芯片制造项目"资本金，并由公司全资子公司芯联越州集成电路制造 （绍兴）有限公司（以下简称"芯联越州"）为上述新型政策性金融工具提供连带责任保证。 芯联集成电路制造股份有限公司 关于拟申请新型政策性金融工具事项及全资子公司为公司担保的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性承担个别及连带责任。 重要内容提示： ● 芯联集成电路制造股份有限公司（以下简称"公司"）拟向国家开发银行全资子公司国开新型政策性金 融工具有限公司申请不超过人民币18亿元的新型政策性金融工具 ● 公司全资子公司芯联越州为本次新型政策性金融 ...

Group 1: Apple Inc. - Apple is preparing to launch a MacBook Pro with a touch screen, featuring an OLED display and M6 series chips, expected to be released in late 2026 or early 2027, with a potential price increase of several hundred dollars due to higher component costs [6][7] - Apple CEO Tim Cook met with China's Minister of Commerce Wang Wentao to discuss US-China trade relations and Apple's business development in China, emphasizing the need for stable cooperation between the two countries [3] Group 2: Semiconductor Industry - Chip manufacturer Xilinx plans to increase capital by 1.8 billion yuan to support its 12-inch integrated circuit manufacturing project [7] - TSMC raised its revenue growth forecast for 2025 to the mid-range of 30%, citing stronger-than-expected AI demand, with a projected gross margin of 59% to 61% for Q4 [5] Group 3: Financial Performance - Rongzhi Rixin expects a net profit increase of 871% to 908% year-on-year for the first three quarters of 2025, projecting a profit of 26.4 million to 27.4 million yuan [7] - Shijia Photon reported a 727.74% year-on-year increase in net profit for the first three quarters of 2025, with revenue growth of 113.96% [8]

Core Viewpoint - ChipLink Integrated (芯联集成) plans to invest 1.8 billion yuan in its subsidiary ChipLink Pioneer (芯联先锋) to support the ongoing implementation of the "Phase III 12-inch integrated circuit analog-digital mixed chip manufacturing project" [2] Group 1: Investment and Financials - The total investment for the Phase III project is estimated at 22.2 billion yuan, aiming to achieve a production capacity of 100,000 wafers per month, with applications in new energy, automotive, industrial control, and consumer sectors [2] - As of June 30, 2025, ChipLink Pioneer reported total assets of 13.65 billion yuan and net assets of 8.589 billion yuan, with revenues of 840 million yuan and 570 million yuan for 2024 and the first half of 2025, respectively [3] - The company reported a net loss of 1.3 billion yuan in 2024 and 580 million yuan in the first half of 2025 [3] Group 2: Strategic Development - The capital increase will solidify the company's control over its subsidiary, aligning with its long-term strategic development and enhancing market competitiveness [3] - The funding source for this capital increase is a new type of policy-based financial tool, which offers long-term funding at low interest rates, effectively reducing the company's overall financing costs [3] - ChipLink Integrated aims to become a world-leading one-stop chip system foundry, focusing on core chips and modules for power control, power drive, and sensor signal chains in automotive, industrial control, and AI fields [3][4] Group 3: Recent Performance - In the first half of the year, ChipLink Integrated achieved operating revenue of 3.495 billion yuan, a year-on-year increase of 21.38%, while reducing its net loss to 170 million yuan [3] - The company reported a net profit of 12 million yuan in the second quarter, marking its first positive quarterly net profit [3]

Core Viewpoint - The company plans to invest 1.8 billion yuan in its subsidiary, Chip Union Pioneer, to support the ongoing implementation of a 12-inch integrated circuit analog-digital mixed chip manufacturing project, reflecting confidence in the market for power module applications and the importance of new policy financial tools [1][2] Group 1: Investment and Financials - The total investment for the 12-inch integrated circuit project is projected to be 22.2 billion yuan, with a production capacity of 100,000 wafers per month, targeting applications in new energy, automotive, industrial control, and consumer sectors [1] - As of June 30, 2025, Chip Union Pioneer reported total assets of 13.65 billion yuan and net assets of 8.589 billion yuan, with revenues of 840 million yuan and 570 million yuan for 2024 and the first half of 2025, respectively, alongside net losses of 1.3 billion yuan and 580 million yuan [2] - The investment price for the capital increase will not exceed 1.11 yuan per registered capital, based on the subsidiary's development status and future plans [2] Group 2: Strategic Development - The funding for the capital increase will come from new policy financial tools, which offer long-term funding at low interest rates, thereby reducing the company's overall financing costs and supporting its long-term development strategy [2] - The company aims to become a world-leading one-stop chip system foundry, focusing on core chips and modules for power control, power drive, and sensor signal chains in automotive, industrial control, and AI fields [2] - In the first half of the year, the company achieved revenue of 3.495 billion yuan, a year-on-year increase of 21.38%, and significantly reduced its net loss to 170 million yuan, with a positive net profit of 12 million yuan in the second quarter [2]

Core Viewpoint - The company plans to increase its investment in its subsidiary, Chip Union Pioneer, by 1.8 billion yuan to support the ongoing implementation of the "Phase III 12-inch integrated circuit analog mixed chip manufacturing project" [1] Investment Details - The total investment for the Phase III project is expected to reach 22.2 billion yuan, aiming to achieve a production capacity of 100,000 wafers per month [1] - After the capital increase, the registered capital of Chip Union Pioneer will not be less than 13.292 billion yuan, with the company maintaining at least a 50.85% stake [1] Project Status - The production line for the project has completed preliminary construction, and all process platforms have entered the stage of mass production [1] - The products from this project are expected to have wide applications in sectors such as new energy, automotive, industrial control, and consumer electronics [1] Strategic Implications - This capital increase reinforces the company's control over its subsidiary, which is beneficial for long-term development and helps expand market scale and enhance market competitiveness [1]

Core Viewpoint - The company plans to increase its investment in its subsidiary, ChipLink Pioneer, by 1.8 billion yuan to support the ongoing implementation of the "Phase III 12-inch integrated circuit analog mixed-signal chip manufacturing project" [1] Group 1: Investment and Capital Structure - The capital increase will ensure that ChipLink Pioneer has a registered capital of no less than 13.292 billion yuan, with the company maintaining at least a 50.85% stake in the subsidiary [1] - Other shareholders will waive their preemptive rights in this capital increase [1] Group 2: Project Details - The total investment for the Phase III project is expected to reach 22.2 billion yuan, aiming to achieve a production capacity of 100,000 wafers per month [1] - The products from this project are intended for diverse applications, including new energy, automotive, industrial control, and consumer sectors [1] - The production line has completed its preliminary construction, and all process platforms have entered the stage of mass production [1] Group 3: Strategic Implications - This capital increase reinforces the company's control over its subsidiary, which is beneficial for long-term development [1] - The move is expected to help the company expand its market scale and enhance its competitive position in the market [1]

证券代码：688469 证券简称：芯联集成 公告编号：2025-055 会议召开时间：2025 年 10 月 28 日（星期二）15:00-16:30 会议召开地点：价值在线（www.ir-online.cn） 会议召开方式：网络互动方式 在"价值在线"（www.ir-online.cn）召开芯联集成电路制造股份有限公司 2025 年第三季度业绩说明会，与投资者进行沟通和交流，广泛听取投资者的意见和建 议。 二、说明会召开的时间、地点和方式 芯联集成电路制造股份有限公司 关于召开2025年第三季度业绩说明会的公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 会 议 问 题 征 集 ： 投 资 者 可 于 2025 年 10 月 28 日 前 访 问 网 址 https://eseb.cn/1spzuBVgOME 或使用微信扫描下方小程序码进行会前提 问，公司将通过本次业绩说明会，在信息披露允许范围内就投资者普遍 关注的问题进行回答。 一、说明会类型 芯联集成电路制造股份有限公司（以下简称"公司"）将于 2 ...

证券代码：688469 证券简称：芯联集成 公告编号：2025-054 芯联集成电路制造股份有限公司 关于公司向控股子公司增资的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 交易实施尚需履行的审批及其他相关程序 本次交易无需股东大会审议 本次增资事项尚需芯联先锋股东会审议通过后方可实施 一、本次增资概述 （一）本次交易概况 1、本次交易概况 基于公司的整体战略发展规划和实际经营需求，看好功率模组应用配套所需 各类芯片的市场发展，以及新型政策性金融工具的落实和推进的重要契机，公司 拟向控股子公司芯联先锋增资人民币 18 亿元，保障"三期 12 英寸集成电路数 模混合芯片制造项目"的持续实施。增资后，芯联先锋的注册资本不低于 1,329,244.16 万元，其他股东拟放弃优先认购权，芯联集成对芯联先锋的持股比 例不低于 50.85%。 | | □新设公司 增资现有公司（□同比例 非同比例） | | --- | --- | | | --增资前标的公司类型：□全资子公司 控股子公司 | | 投资类型 | □参股公司 □未 ...

证券代码：688469 证券简称：芯联集成 公告编号：2025-053 芯联集成电路制造股份有限公司 关于拟申请新型政策性金融工具事项及全资子公司为公司 担保的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带责任。 重要内容提示： 一、公司申请新型政策性金融工具及全资子公司为公司担保情况概述 公司及公司控股子公司芯联先锋集成电路制造（绍兴）有限公司（以下简称 "芯联先锋"）均为国家高新技术企业，同时芯联先锋承接的"三期 12 英寸集 成电路数模混合芯片制造项目"制造生产的功率模组应用配套所需各类芯片，是 人工智能、物联网、新能源汽车等众多战略性新兴产业的基础，高度契合数字化、 智能化发展方向，精准匹配科技自立自强、发展壮大战略性新兴产业的政策导向。 基于新型政策性金融工具的落实和推进的契机，为了保障"三期 12 英寸集 成电路数模混合芯片制造项目"的持续实施，公司拟向国家开发银行全资子公司 国开新型政策性金融工具有限公司申请不超过人民币 18 亿的政策性金融工具， 期限为 5 年。新型政策性金融工具资金将通过权益性资金注入 ...