兴森科技：FCBGA封装基板项目目前处于小批量生产阶段

Core Viewpoint - The company is currently in the small batch production phase of its FCBGA packaging substrate project, with market expansion and customer certification progressing as planned [1] Group 1 - The FCBGA packaging substrate's production capacity, technology, and yield are sufficient to meet the demands of existing customers [1]