凯格精机：公司的封装设备主要应用于LED及半导体封装环节的固晶工序

Core Viewpoint - The company, Kaige Precision Machinery (301338), is focusing on enhancing its packaging equipment for LED and semiconductor packaging processes, particularly in the die bonding segment, which is crucial for transferring bare chips from wafers to substrates [1] Group 1: Company Developments - The company's packaging equipment is primarily used in the die bonding process, which automates the fixing or bonding of chips to carrier substrates or lead frames [1] - The upgrade of packaging equipment has effectively improved product profitability, allowing the company to penetrate the broader semiconductor market [1] - The company is leveraging the advantages of die bonders in terms of efficiency and stability to expand its Mini/Micro LED die bonder business and increase market share [1] Group 2: Market Trends - The continuous maturation of COB (Chip on Board) and MiP (Micro LED in Package) technologies is driving an increase in market demand [1] - Several downstream major clients have achieved new breakthroughs, indicating a positive trend in the industry [1]