USC(SH:688403) Xin Lang Cai Jing·2025-11-14 07:49Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is strategically expanding its business in the semiconductor industry, particularly in advanced packaging and storage chip sectors, to capitalize on the growing demand driven by AI infrastructure [2][3]. Group 1: Company Developments - On October 14, 2025, the company announced a significant investment, acquiring a 27.5445% stake in Hefei Xinfeng Technology Co., Ltd., and forming a strategic partnership with East China Technology (Suzhou) Co., Ltd. to expand into 3D DRAM and other storage chip packaging services [2]. - The company is focusing on advanced packaging technologies, including Chiplet, Fan-out, 2.5D/3D, and SiP, leveraging its expertise in bump manufacturing as a foundational technology [2][3]. - As of September 30, 2025, the company reported a revenue of 1.295 billion yuan, a year-on-year increase of 21.05%, and a net profit of 124 million yuan, up 23.21% [9]. Group 2: Financial Performance - The company's overseas revenue accounted for 54.15% of total revenue, benefiting from the depreciation of the Chinese yuan [4]. - The average trading cost of the company's shares is 16.38 yuan, with the stock currently near a support level of 14.42 yuan [7]. - The company has distributed a total of 161 million yuan in dividends since its A-share listing [9]. Group 3: Market Position - Hefei Xinhui Microelectronics specializes in integrated circuit advanced packaging and testing services, with its main products being integrated circuit packaging tests [3][8]. - The company operates within the semiconductor industry, specifically in the integrated circuit packaging and testing sector, and is involved in various concept sectors including advanced packaging and LED [8].