盛合晶微科创板IPO进入问询阶段

Core Viewpoint - Shenghe Jingwei Semiconductor Co., Ltd. has entered the inquiry stage for its IPO on the Sci-Tech Innovation Board, aiming to raise approximately 4.8 billion yuan for advanced packaging projects [1] Company Overview - Shenghe Jingwei is an advanced packaging enterprise specializing in integrated circuit wafer-level packaging [1] - The company’s IPO application was accepted on October 30, 2025 [1] Fundraising Purpose - The funds raised from the IPO will be allocated to a three-dimensional multi-chip integration packaging project and an ultra-high-density interconnection three-dimensional multi-chip integration packaging project [1]