Group 1 - The core point of the news is that Henan Innovation Investment Group Co., Ltd. successfully issued its first phase of technology innovation bonds for 2025, totaling 500 million yuan with a coupon rate of 2.16% and a maturity of 5 years [1] - The main underwriter for this bond issuance is Shanghai Pudong Development Bank, with China Industrial and Commercial Bank as a joint lead underwriter [1] - The credit rating for Henan Innovation Investment Group is AAA, with a stable outlook, and the same rating applies to the technology innovation bonds issued [1] Group 2 - The funds raised from this bond issuance will be used entirely to replace the issuer's own capital invested in technology innovation-related funds within one year, after deducting issuance costs [1] - Henan Innovation Investment Group was established in September 2022, with a registered capital of 20 billion yuan, and serves as a key state-owned technology investment institution in Henan Province [3] - The group is responsible for the investment operation of emerging industry investments and venture capital guiding funds in Henan Province [3]
河南创新投资集团5亿元科创债完成发行,利率2.16%
Sou Hu Cai Jing·2025-11-17 09:16