盛美上海交付首台水平式面板电镀设备 响应先进封装市场需求

Group 1 - The core point of the news is that Shengmei Shanghai has successfully delivered its first panel-level advanced packaging electroplating equipment, Ultra ECP ap-p, to a leading panel manufacturing customer, marking a significant advancement in the large panel market [1] - The Ultra ECP ap-p system is the first commercial panel-level copper electroplating system designed for large panels, supporting electroplating processes in pillar, bump, and redistribution layer (RDL) technologies, achieving performance comparable to traditional round wafer processes [1] - The system utilizes patented ACM technology for horizontal electroplating and supports multiple materials including copper, nickel, tin-silver, and gold, featuring high-speed electroplating paddles designed for high pillar applications [1] Group 2 - Shengmei Shanghai is a supplier of wafer process solutions for semiconductor front-end and advanced wafer-level packaging applications, with a comprehensive portfolio of semiconductor process equipment [2] - The company reported a third-quarter revenue of 1.881 billion yuan, a year-on-year increase of 19.61%, and a net profit of 570 million yuan, up 81.04% year-on-year [2] - For the first three quarters of 2025, the company achieved a revenue of 5.146 billion yuan, a year-on-year increase of 29.42%, and a net profit of 1.266 billion yuan, up 66.99% year-on-year, driven by significant growth in main business revenue and gross profit [2]