通富微电：公司紧跟行业技术发展趋势，抓住市场发展机遇

Core Viewpoint - The company is actively developing advanced packaging technologies and expanding its production capacity to seize market opportunities and enhance its competitive edge in the semiconductor industry [1] Group 1: Technology Development - The company is focusing on high value-added products and market hotspots by developing advanced packaging technologies such as fan-out, wafer-level, and flip-chip packaging [1] - The company is also strategically positioning itself in cutting-edge packaging technologies like Chiplet and 2D+ to create a differentiated competitive advantage [1] Group 2: Market Strategy - The company is aligning its development efforts with industry technology trends to capture future market opportunities [1] - The emphasis on long-term planning and capacity expansion indicates a commitment to sustaining growth in a competitive landscape [1]