生益电子拟定增募资不超过26亿元

Core Viewpoint - The company plans to raise up to 2.6 billion yuan through a private placement to fund projects related to AI computing HDI production, smart manufacturing high-layer circuit boards, and to supplement working capital and repay bank loans [1] Group 1: Investment Projects - The AI computing HDI production base will be located in Dongguan, Guangdong, with a total investment of 2.032 billion yuan, utilizing 1 billion yuan from the raised funds, and is expected to start trial production in the third year and reach full production by the fifth year [3] - The smart manufacturing high-layer circuit board project will be located in Ji'an, Jiangxi, with a total investment of 1.937 billion yuan, utilizing 1.1 billion yuan from the raised funds, and is expected to start trial production in the second year and reach full production by the fourth year [3] Group 2: Industry Context and Company Strategy - The global technology industry is undergoing a transformation centered around AI, creating opportunities in AI computing clusters, embodied intelligence, and 6G communication, which is expected to drive rapid growth in PCB demand [1] - The company aims to leverage its leading technology and production management capabilities to enhance high-end PCB capacity and break away from homogeneous competition, thereby promoting the domestic PCB industry towards high-end and high-value-added directions [2]