Company Overview - Hengkun New Materials is set to begin subscription tomorrow, with a total share capital of 382 million shares before the issuance and plans to publicly issue 67.3979 million shares, accounting for 15.00% of the total share capital post-issuance [1] - The subscription price is set at 14.99 yuan, with an issuance price-to-earnings ratio of 71.42 times, compared to the industry average of 60.47 times [1] - The company’s products are essential materials for integrated circuit wafer manufacturing, primarily used in advanced NAND, DRAM storage chips, and logic chips at 90nm technology nodes and below [1] Subscription Details - The subscription code is 787727, with an online issuance of 10.7835 million shares and a maximum subscription limit of 10,500 shares per account [1] - The subscription date is November 7, 2025, with the announcement of the winning numbers and payment date on November 11, 2025 [1] Financial Highlights - Total assets for 2024 are reported at 2.645 billion yuan, an increase from 2.091 billion yuan in 2023 and 1.633 billion yuan in 2022 [1] - Net assets have grown to 1.500 billion yuan in 2024 from 1.382 billion yuan in 2023 and 1.273 billion yuan in 2022 [1] - Operating revenue for 2024 is 547.9388 million yuan, up from 367.7078 million yuan in 2023 and 321.7652 million yuan in 2022 [1] - The net profit attributable to shareholders for 2024 is 96.9192 million yuan, compared to 89.8493 million yuan in 2023 and 100.9030 million yuan in 2022 [1] - Research and development investment for 2024 is 88.6085 million yuan, representing 16.17% of operating revenue, an increase from 14.59% in 2023 and 13.28% in 2022 [1] Fundraising Allocation - The company plans to allocate 399.8022 million yuan to the second phase of the integrated circuit precursor project and 606.8928 million yuan to the advanced materials project for integrated circuits [1]
恒坤新材明日申购 顶格申购需配市值10.50万元