生益电子拟定增募资26亿元，加码高端PCB产能

Core Viewpoint - The company plans to raise up to 2.6 billion yuan through a private placement to fund the construction of AI computing HDI production base and smart manufacturing high-layer circuit board projects, as well as to supplement working capital and repay bank loans [1][2]. Group 1: Fundraising and Projects - The total investment for the AI computing HDI production base project is estimated at 2.032 billion yuan, with 1 billion yuan from the raised funds, a construction period of 36 months, and production expected to start in the third year, reaching full capacity by the fifth year, with an annual capacity of 167,200 square meters [1]. - The smart manufacturing high-layer circuit board project has a total investment of 1.937 billion yuan, with 1.1 billion yuan from the raised funds, divided into two phases over 30 months, with production starting in the second year and reaching full capacity by the fourth year, targeting an annual capacity of 700,000 square meters [1]. Group 2: Financial Performance - In Q3, the company reported a revenue of 3.06 billion yuan, a year-on-year increase of 153.71%, which is approximately 81% of the first half's revenue; net profit attributable to shareholders was 584 million yuan, up 545.95% year-on-year, exceeding the first half by 54 million yuan [2]. - The increase in high-value-added products has strengthened the company's competitive advantage in the mid-to-high-end market, contributing to significant growth in revenue and net profit compared to the previous year [2]. Group 3: Short-term Financial Pressure - Despite strong performance, the company faces short-term financial pressure, with cash increasing from 410 million yuan at the end of last year to 681 million yuan; accounts receivable rose from 1.747 billion yuan to 3.363 billion yuan [2]. - Short-term borrowings have also significantly increased from 1.073 billion yuan to 2 billion yuan since the end of last year [3].