Core Viewpoint - Xiamen Hengkang New Materials Technology Co., Ltd. has officially listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board, establishing itself as a leader in the domestic semiconductor key materials sector, particularly in the production of SOC and BARC lithography materials, which are essential for chip manufacturing [1][18]. Company Overview - Hengkang New Materials is recognized as a national-level "specialized and innovative" small giant enterprise, with its subsidiary, Fujian Hongguang, designated as a key materials engineering research center for integrated circuit lithography in Fujian Province [2]. Industry Context - The domestic semiconductor key materials market has historically been dominated by foreign companies from Europe, the United States, Japan, and South Korea, with local production rates for critical lithography products being extremely low, often around 1% [3][15]. R&D and Innovation - The company has engaged in a long-term R&D process, which is characterized by high costs and lengthy validation periods of 3 to 5 years for new products [4][6]. - R&D expenditures have shown a consistent increase, reaching approximately 53.66 million yuan in 2023, which is 14.59% of revenue, and projected to rise to 88.61 million yuan in 2024, accounting for 16.17% of revenue [6][7]. - As of June 2025, the company holds 101 patents, including 43 invention patents, reflecting significant technological accumulation [8]. Market Performance - The sales revenue from self-produced products has grown significantly, with figures of 124 million yuan in 2022, 190 million yuan in 2023, and 344 million yuan in 2024, resulting in a compound annual growth rate of 66.89% [9]. - The company has supplied over 55,000 gallons of lithography materials and has developed over 100 product variations [9]. Strategic Importance - Hengkang New Materials has become a key player in national strategic tasks, successfully completing several major projects and providing critical lithography material solutions for advanced chip technologies [10][12]. - The shift towards "domestic substitution" in the semiconductor industry has created significant opportunities for the company, as clients are now actively seeking collaboration on product development [13][14]. Competitive Position - The company has achieved the status of the leading domestic manufacturer for its SOC and BARC products, effectively replacing foreign competitors such as DuPont and Shin-Etsu [18]. - Hengkang New Materials has received recognition from major industry clients, including awards for value creation and R&D collaboration, indicating strong customer acceptance of its products [19]. Financial Support and Future Plans - The company has invested over 1 billion yuan in equipment procurement, capacity building, and technology R&D, with ongoing support from local investment funds [20][21]. - The recent fundraising of 1.01 billion yuan from its IPO will be allocated to key projects aimed at advancing the development and industrialization of critical materials, enhancing the domestic supply chain for high-end integrated circuit materials [21][22].
恒坤新材挂牌科创板：光刻材料“国产第一”是如何“炼”成的？