Core Insights - Xiamen Hengkang New Materials Technology Co., Ltd. successfully listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board, raising 1.01 billion yuan [1][3] - The company specializes in the research, production, and sales of key materials for integrated circuits, particularly in photolithography materials and precursors, and is one of the few domestic firms capable of developing and mass-producing 12-inch integrated circuit wafer manufacturing materials [3] - The IPO project was completed in less than 11 months, showcasing the efficiency of the underwriting process led by Zhongtai Securities [3][4] Company Overview - Hengkang New Materials is recognized for its innovative capabilities in the advanced process materials sector, establishing a strong technological "moat" [3] - The company has contributed significantly to the domestic integrated circuit industry by addressing critical material challenges through participation in national science and technology projects [3] Underwriting and Market Position - Zhongtai Securities played a crucial role in the IPO process, emphasizing its commitment to client-centered service and its core values [3][4] - Since 2025, Zhongtai Securities has completed two IPO projects on the Sci-Tech Innovation Board, with a total underwriting scale of 1.151 billion yuan, ranking third in the industry for both the number and scale of IPOs [4] - The firm aims to enhance its investment banking capabilities and provide comprehensive financial services to support the high-quality development of the real economy [4]