中伦助力拓荆键科完成融资

Group 1 - The core point of the news is that拓荆键科 has completed a new round of financing amounting to approximately 1 billion yuan, led by国投集新, with the participation of several well-known investors [2][3] - The leading investor,国投集新, is solely backed by the国家集成电路产业投资基金三期股份有限公司, marking the first investment by this fund since its establishment in 2024, indicating strong recognition of拓荆键科's technological capabilities and growth prospects by national-level capital [3] -拓荆键科, a subsidiary of拓荆科技, focuses on the research and industrial application of advanced bonding equipment for three-dimensional integration, including mixed bonding and fusion bonding equipment, as well as associated measurement devices [3] Group 2 - The company has launched several products, including wafer-to-wafer mixed bonding equipment, wafer-to-wafer fusion bonding equipment, chip-to-wafer bonding pre-treatment equipment, and various measurement devices, which have been delivered to clients in advanced storage, logic, and image sensor sectors [3] - The legal services for this financing round were provided by中伦律师事务所, with partner都伟 leading the project and team members including lawyers姚腾越 and谢莹 [3]