光莆股份：光集成传感3D叠Die封装产品主要应用在智能手机、智能穿戴、无人机、机器人、AR/VR 等领域

Core Viewpoint - The company is focusing on the development of its 3D stacked packaging products for various applications, while currently not having a presence in the high bandwidth memory (HBM) sector [1] Group 1 - The company's light integration sensor 3D stacked die packaging products are primarily used in smartphones, smart wearables, drones, robots, and AR/VR fields [1] - The technology used in these products is similar to that found in high bandwidth memory (HBM) 3D stacking technology, but the application areas differ [1] - The company has not yet entered the HBM sector but plans to monitor developments in this area based on technological advancements and industry trends [1]