光莆股份(300632.SZ)：光集成传感3D叠Die封装产品主要应用在智能手机、智能穿戴、无人机、机器人、AR/VR 等领域

Core Viewpoint - The company, Guangpu Co., Ltd. (300632.SZ), is exploring the development of its optical integrated sensor 3D stacked die packaging products, which are primarily applicable in fields such as smartphones, smart wearables, drones, robotics, and AR/VR [1] Group 1 - The company's 3D stacked die packaging products share a common origin with high bandwidth memory (HBM) technology but differ in application fields [1] - Currently, the company has not yet entered this sector but plans to monitor developments based on technological advancements and industry trends [1]