立昂微:年产180万片12英寸半导体硅外延片项目正在建设中,与重掺衬底片项目可形成完整产业链

Core Viewpoint - The company is currently constructing a project for the annual production of 1.8 million pieces of 12-inch semiconductor silicon epitaxial wafers, which is part of its convertible bond project for 2022. This project is expected to complement another project disclosed on November 18, 2025, for the annual production of 1.8 million pieces of heavily doped substrate wafers, forming a complete industrial chain from single crystal to epitaxy, thereby enhancing the company's production capacity and overall competitiveness [1] Group 1 - The company is building a project for the annual production of 1.8 million pieces of 12-inch silicon epitaxial wafers [1] - The two projects will create a complete industrial chain from single crystal to epitaxy [1] - The projects aim to improve the company's production capacity of heavily doped silicon wafers and optimize product structure [1]