2025年 相控阵T/R芯片行业词条报告 头豹分类/制造业/计算机、通信和其他电子设备制造业/电子 器件制造/集成电路制造 Copyright © 2025 头豹 智驭波束——相控阵T/R芯片在军民融合与智能浪潮中的核心跃迁 头豹词条报告系列 梁霄同 · 头豹分析师 梁 2026-02-05 未经平台授权，禁止转载 行业分类： 制造业/集成电路制造 摘要 相控阵T/R芯片是相控阵雷达核心元器件，决定雷达天线参数和整机性能，且探测效能与芯片配置数量紧密相关。其行业特征包括应用领域广泛、军用战略意义强、利润空 间高。2020-2025年，行业市场规模由8.41亿增至24.80亿，预计2026-2030年将增至44.82亿。历史增长得益于智能驾驶与5G基站需求扩张，以及军民融合推动。未来，卫 星互联网加速组网、智能驾驶产业高速发展，将进一步拉动相控阵T/R芯片需求，推动行业规模持续扩大。 行业定义 相控阵T/R芯片是相控阵雷达的核心元器件之一，通常集成于T/R组件内，承担信号发射、接收及幅相调控的关键功能，以此实现雷达的波束 赋形与波束扫描。该芯片的性能指标直接决定雷达天线的参数表现，对整机综合性能起着决定性作用。 ...

2025年 相控阵T/R芯片行业词条报告 头豹分类/制造业/计算机、通信和其他电子设备制造业/电子 器件制造/集成电路制造 Copyright © 2025 头豹 梁霄同 · 头豹分析师 梁 2026-02-05 未经平台授权，禁止转载 行业分类： 制造业/集成电路制造 摘要 相控阵T/R芯片是相控阵雷达核心元器件，决定雷达天线参数和整机性能，且探测效能与芯片配置数量紧密相关。其行业特征包括应用领域广泛、军用战略意义强、利润空 间高。2020-2025年，行业市场规模由8.41亿增至24.80亿，预计2026-2030年将增至44.82亿。历史增长得益于智能驾驶与5G基站需求扩张，以及军民融合推动。未来，卫 星互联网加速组网、智能驾驶产业高速发展，将进一步拉动相控阵T/R芯片需求，推动行业规模持续扩大。 行业定义 相控阵T/R芯片是相控阵雷达的核心元器件之一，通常集成于T/R组件内，承担信号发射、接收及幅相调控的关键功能，以此实现雷达的波束 赋形与波束扫描。该芯片的性能指标直接决定雷达天线的参数表现，对整机综合性能起着决定性作用。除此之外，相控阵雷达的探测效能还与相 控阵T/R芯片的配置数量紧密相关，一部雷达 ...

证券研究报告 | 行业专题研究 gszqdatemark 2026 03 25 年 月 日 电子 AI 驱动先进硅片需求高增，大硅片行业延续复苏势态 硅片是芯片制造的地基，占晶圆制造材料比重达 30%。半导体硅片是生 产集成电路、分立器件、传感器等半导体产品的关键材料，是半导体产业 链基础性的一环，其核心工艺包括晶体生长、加工工艺、外延工艺等，技 术专业化程度颇高。目前全球 95%以上的半导体器件采用硅片作为衬底， 占半导体器件 80%的集成电路产品中 99%以上采用硅片作为衬底。在硅 片衬底的基础上，通过光刻、刻蚀、薄膜沉积、离子注入等多道工序完成 各类半导体器件制作，从而硅片是芯片制造的地基。根据 SEMI 统计，2024 年九大类晶圆制造材料中硅片占比 30%，是晶圆制造耗用最大的材料。 硅片向大尺寸发展，12 英寸更具经济效益。半导体硅片尺寸（以直径计 算）主要有 2 英寸、3 英寸、4 英寸、6 英寸、8 英寸与 12 英寸等规格， 摩尔定律推动下，半导体硅片朝着更大尺寸发展。硅片尺寸越大，每片硅 片上能够制造的芯片数量越多，从而使单个芯片的生产成本降低。在相同 工艺条件下，300mm 半导体硅片可 ...

证券研究报告 | 行业专题研究 gszqdatemark 2026 03 25 年 月 日 电子 AI 驱动先进硅片需求高增，大硅片行业延续复苏势态 硅片是芯片制造的地基，占晶圆制造材料比重达 30%。半导体硅片是生 产集成电路、分立器件、传感器等半导体产品的关键材料，是半导体产业 链基础性的一环，其核心工艺包括晶体生长、加工工艺、外延工艺等，技 术专业化程度颇高。目前全球 95%以上的半导体器件采用硅片作为衬底， 占半导体器件 80%的集成电路产品中 99%以上采用硅片作为衬底。在硅 片衬底的基础上，通过光刻、刻蚀、薄膜沉积、离子注入等多道工序完成 各类半导体器件制作，从而硅片是芯片制造的地基。根据 SEMI 统计，2024 年九大类晶圆制造材料中硅片占比 30%，是晶圆制造耗用最大的材料。 硅片向大尺寸发展，12 英寸更具经济效益。半导体硅片尺寸（以直径计 算）主要有 2 英寸、3 英寸、4 英寸、6 英寸、8 英寸与 12 英寸等规格， 摩尔定律推动下，半导体硅片朝着更大尺寸发展。硅片尺寸越大，每片硅 片上能够制造的芯片数量越多，从而使单个芯片的生产成本降低。在相同 工艺条件下，300mm 半导体硅片可 ...

证券代码：605358 证券简称：立昂微 公告编号：2026-012 债券代码：111010 债券简称：立昂转债 杭州立昂微电子股份有限公司 关于为控股子公司提供担保的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏， 并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 担保对象及基本情况 | 被担保人名称 | 本次担保金额 | | 实际为其提供的担 保余额（不含本次担 | | 是否在前 期预计额 | 本次担保是 否有反担保 | | --- | --- | --- | --- | --- | --- | --- | | | | | 保金额） | | 度内 | | | 金瑞泓科技（衢州）有限公司 | 30,000 | 万元 | 36,729.20 | 万元 | 是 | 否 | | 金瑞泓微电子（衢州）有限公 | 10,000 | 万元 | 43,900 | 万元 | 是 | 否 | | 司 | | | | | | | | 海宁立昂东芯微电子有限公司 | 1,000 | 万元 | 61,453.64 | 万元 | 是 | 否 | 累计担保情况 | 对外担保逾期 ...

Group 1 - The core point of the article is that Lian Microelectronics (605358.SH) announced that its subsidiary, Jinruihong Technology (Quzhou) Co., Ltd., received a government subsidy related to revenue amounting to 27 million yuan, which represents 10.16% of the company's audited net profit attributable to shareholders for the most recent fiscal year [1]

Group 1 - The company Li'ang Micro announced on February 27 that its subsidiary Jinruihong Technology (Quzhou) Co., Ltd. received a government subsidy of 27 million yuan, which accounts for 10.16% of the absolute value of the net profit attributable to the shareholders of the listed company for the most recent audited fiscal year [1] Group 2 - In February, China's AI usage surpassed that of the United States for the first time, with four domestic models ranking among the top five globally, indicating an exponential growth in demand for domestic computing power [1]

证券代码：605358 证券简称：立昂微 公告编号：2026-011 债券代码：111010 债券简称：立昂转债 杭州立昂微电子股份有限公司（以下简称"公司"）控股子公司金瑞泓科技（衢州）有限 公司于近日收到与收益相关的政府补助 2,700.00 万元，占公司最近一个会计年度经审计归属 于上市公司股东的净利润绝对值的 10.16%。 二、补助的类型及其对上市公司的影响 杭州立昂微电子股份有限公司 关于获得政府补助的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并 对其内容的真实性、准确性和完整性承担个别及连带责任。 一、获取补助的基本情况 特此公告。 杭州立昂微电子股份有限公司董事会 2026 年 2 月 28 日 根据《企业会计准则第 16 号--政府补助》有关规定，上述政府补助资金均为与收益相关 的政府补助，预计计入 2026 年度当期损益的金额为 2,700.00 万元,将对公司 2026 年度净利润 产生积极影响。最终的会计处理以及对公司当年利润产生的影响以会计师年度审计确认后的结 果为准。敬请投资者注意投资风险。 ...

Core Viewpoint - A price increase wave is sweeping through the semiconductor industry, with multiple companies announcing price hikes ranging from 10% to 80% due to rising costs of raw materials and supply chain pressures [1][12]. Price Increases - Companies such as Huazhong Micro, Zhongwei Semiconductor, and others have issued price increase notices, with the hikes affecting various product categories including MCU, NOR Flash, and power devices [1][12]. - The price adjustments are primarily attributed to significant increases in the costs of upstream raw materials and key precious metals, alongside an imbalanced supply-demand situation [1][12]. Raw Material Costs - The price surge in copper, silver, and tin has been identified as a major factor driving the increase in chip product prices, rather than the cost of silicon wafers [13]. - As of January 29, 2026, copper prices reached 101,600 CNY per ton, marking a year-on-year increase of 35.08% [13]. - Analysts predict that copper prices may continue to rise due to geopolitical tensions and supply constraints, despite high global inventories [14]. Supply-Demand Imbalance - The current supply-demand dynamics and production capacity constraints are significant contributors to the ongoing price increases in semiconductor products [21]. - Companies like Zhongwei Semiconductor have announced price hikes of 15% to 50% for products like MCU and NOR Flash due to severe supply-demand conditions [21]. - The semiconductor industry is expected to continue experiencing price increases as downstream inventory replenishment efforts exceed expectations and upstream metal prices remain high [21][22]. Company Responses - Huazhong Micro has initiated a price increase of at least 10% across its entire range of microelectronic products, effective from February 1, 2026, to address rising costs and maintain profitability [18]. - Other companies, including Silan Micro and New Clean Energy, have also announced similar price adjustments, reflecting the widespread nature of the cost pressures across the industry [19][16].

Investment Rating - The report does not explicitly provide an investment rating for the semiconductor materials industry Core Insights - The global semiconductor materials market is characterized by "long-term growth and cyclical fluctuations," with the market size expected to grow from $27.5 billion in 2000 to $67.47 billion by 2024, driven by the demand for advanced semiconductor materials in various high-tech applications [3][5] - China's semiconductor materials industry has made significant progress in mid-to-low-end products but still relies heavily on imports for high-end materials, indicating a substantial opportunity for domestic production and technological breakthroughs [1][10] - The report emphasizes the need for a dual approach of technological breakthroughs and ecosystem building to drive the development of the semiconductor materials industry, supported by government policies and strategic collaborations [1][23] Industry Overview - Semiconductor materials are critical strategic materials for the semiconductor industry, with the market experiencing long-term growth and cyclical fluctuations due to factors such as industry cycles and end-user demand [2][3] - The market structure is shifting as the industry chain relocates and domestic production increases, with China rapidly expanding its market share driven by local demand and government policies [5][10] - The report highlights the significant market concentration in the semiconductor materials sector, with a few leading companies dominating the market [10] Industry Bottlenecks - Despite achieving local supply capabilities in mid-to-low-end products, China still faces challenges in high-end semiconductor materials, which remain heavily reliant on imports [10][13] - Key areas such as silicon wafers, electronic specialty gases, and photoresists are identified as critical segments where domestic production is lagging behind, with high-end products still largely imported [13][18][21] - The report notes that the domestic supply of electronic specialty gases is weak, with an overall localization rate of about 15% expected in 2024, indicating a significant gap in high-end product capabilities [16] Path to Breakthrough - The semiconductor materials industry must focus on technological advancements and ecosystem development, emphasizing collaboration between academia, research institutions, and leading enterprises to address core technological challenges [23][24] - Establishing a robust and efficient results transformation chain is crucial, with a focus on concept validation, pilot testing, and mass production to enhance the commercialization of technological innovations [24][25] - The report advocates for a self-sufficient and sustainable industry ecosystem, extending upstream to secure high-purity raw materials and key equipment while deepening collaboration with downstream chip design and manufacturing companies [25] Policy Empowerment - National policies are increasingly directing the industry towards key areas, with a focus on advanced semiconductor materials as a strategic priority [26][27] - The establishment of pilot platforms for new materials is highlighted as a key initiative to support the industry's development, with plans to create approximately 300 local pilot platforms by 2027 [28] - Financial policies are also being implemented to support innovation and market transformation in the new materials sector, including insurance compensation for high-risk areas [29] Future Outlook - The semiconductor materials industry is expected to evolve towards a high-quality development phase, balancing quality and safety while fostering collaboration between domestic and international players [34] - The focus will shift from isolated breakthroughs to collaborative ecosystems, with an emphasis on meeting the increasing demands for material purity, performance, and stability from downstream applications [34]