立昂微：公司2022年可转债项目“年产180万片12英寸半导体硅外延片项目”目前正在建设中

Core Viewpoint - The company is currently constructing a project for an annual production capacity of 1.8 million pieces of 12-inch semiconductor silicon epitaxial wafers, which is expected to enhance its competitiveness by forming a complete industrial chain from single crystal to epitaxy [1] Group 1 - The 2022 convertible bond project is focused on the annual production of 1.8 million pieces of 12-inch semiconductor silicon epitaxial wafers [1] - The project is aligned with another project disclosed on November 18, 2025, which aims for an annual production of 1.8 million pieces of heavily doped substrate wafers [1] - Both projects will create upstream and downstream synergies, improving the company's production capacity for heavily doped silicon wafers and optimizing its product structure [1]