天岳先进：已推出12英寸全系列碳化硅衬底

Core Viewpoint - The company has acknowledged the market news regarding NVIDIA's plan to adopt 12-inch silicon carbide substrates in the advanced packaging of its next-generation GPU chips, expected to be implemented by 2027 [1][3]. Group 1: Company Response and Product Development - The use of 12-inch silicon carbide as an intermediary layer material is expected to significantly enhance the thermal efficiency of packaging structures and achieve higher integration density within the same packaging area [3]. - The company has launched a full range of 12-inch substrate products, including semi-insulating, conductive P-type, and conductive N-type, to meet various end-user and process route requirements [3]. Group 2: Industry Insights and Market Trends - Industry experts believe that the continuous rise in AI computing power and high-performance computing demands will drive a full-link upgrade from wafer processes to packaging materials, which is crucial for the growth of silicon carbide and other third-generation semiconductors [4]. - The company's positioning in 12-inch silicon carbide substrates is expected to benefit from the upcoming industrialization of advanced packaging and high-end computing platforms, with market attention on the introduction pace and production scale of subsequent products among leading customers [4].