中银国际证券股份有限公司2024年度第三期短期融资券兑付完成公告

Core Points - The company successfully issued the third phase of short-term financing bonds for the year 2024 on November 19, 2024, amounting to RMB 1 billion with a coupon rate of 1.92% [1] - The maturity period for the bonds is set for one year, with the repayment date scheduled for November 19, 2025, subject to adjustment for holidays [1] - The total principal and interest repayment on the bonds amounted to RMB 1,019,200,000.00 on the due date [1] Summary by Sections - Issuance Details - The company issued short-term financing bonds totaling RMB 1 billion with a coupon rate of 1.92% [1] - The bonds have a maturity of one year, with repayment due on November 19, 2025 [1] - Repayment Information - The company completed the repayment of the principal and interest totaling RMB 1,019,200,000.00 on November 19, 2025 [1]