USC(SH:688403) Xin Lang Cai Jing·2025-11-21 07:49Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is strategically expanding its business in the semiconductor industry, particularly in advanced packaging and storage chip sectors, to capitalize on the growing demand driven by AI infrastructure [2][3]. Company Overview - Hefei Xinhui Microelectronics Co., Ltd. specializes in high-end integrated circuit packaging and testing services, with its main products being integrated circuit packaging tests [3]. - The company was established on December 18, 2015, and went public on August 18, 2022. Its main business revenue composition includes 90.25% from display driver chip packaging and 9.75% from other services [8]. Recent Developments - On October 14, 2025, the company announced a significant investment in Hefei Xinfeng Technology Co., Ltd., acquiring a 27.5445% stake and forming a strategic partnership to expand into 3D DRAM and other storage chip packaging services [2]. - The company is focusing on advanced packaging technologies, including Chiplet, Fan-out, 2.5D/3D, and SiP, to meet customer demands and enhance its technological capabilities [2]. Financial Performance - For the period from January to September 2025, the company reported a revenue of 1.295 billion yuan, representing a year-on-year growth of 21.05%, and a net profit attributable to shareholders of 124 million yuan, up 23.21% year-on-year [9]. - As of September 30, 2024, the company's overseas revenue accounted for 54.15%, benefiting from the depreciation of the RMB [4]. Market Activity - On November 21, the company's stock price fell by 6.71%, with a trading volume of 359 million yuan and a turnover rate of 3.17%, leading to a total market capitalization of 11.085 billion yuan [1].