兴森科技：芯片产品的应用领域由客户根据自身需求确定

Core Viewpoint - The company, Xingsen Technology, is experiencing a recovery in the downstream storage chip sector, leading to a full order book for its CSP packaging substrates, indicating a positive market outlook [1] Group 1: Company Operations - The application fields of the company's chip products are determined by customer needs, with specific customer information kept confidential due to non-disclosure agreements [1] - The FCBGA packaging substrate project is currently in small-batch production, with market expansion and customer certification progressing as planned [1] - The timeline for mass production largely depends on the recovery of industry demand, the production progress of customers, and their supplier management strategies [1]