Core Viewpoint - The semiconductor packaging and testing industry in Shenzhen is rapidly expanding, driven by national integrated circuit strategies, with a growing demand for high-precision metal components essential for the packaging process [1] Group 1: Semiconductor Packaging Industry - Shenzhen's semiconductor packaging industry is experiencing significant growth, particularly in the areas of etching technology, which is crucial for producing high-density lead frames and other components [4] - The etching process allows for the production of complex patterns on metal materials as thin as 0.05mm, maintaining smooth edges and uniform structures, making it ideal for high-density lead frames [4] - The industry requires components such as heat sinks, metal pads, and micro-structured parts that emphasize thermal conductivity, dimensional consistency, and surface quality, which are well-supported by Shenzhen's advanced etching technology [4] Group 2: Advantages of Shenzhen's Etching Technology - Shenzhen's etching technology has a broad material coverage, including copper, aluminum, iron-nickel alloys, and nickel-based materials, which are commonly used in IC packaging [4] - The etching enterprises in Shenzhen have established stable technical systems for uniform corrosion and side-etch control across these materials [4] - The introduction of automation and AI technologies in etching processes has significantly improved the precision and consistency of packaging components, enhancing the industry's competitive edge [5] Group 3: Future Trends and Requirements - As the semiconductor industry moves towards smaller sizes, higher power, and greater density, the demand for precision metal components will increase, necessitating smaller lead spacings and higher thermal capabilities [5] - Shenzhen's etching technology is characterized by strong flexibility, high adaptability, and excellent batch efficiency, positioning it as an indispensable manufacturing process in the future of semiconductor packaging [5]
深圳蚀刻加工与半导体封装产业的协同发展趋势分析
Sou Hu Cai Jing·2025-11-22 09:45