兴森科技：IC封装基板为芯片封装原材料

Core Viewpoint - The company, Xingsen Technology, specializes in IC packaging substrates, which are essential raw materials for chip packaging, targeting chip design companies and packaging manufacturers as its primary customers [1] Group 1 - The company confirmed on November 24 that its IC packaging substrates serve as raw materials for chip packaging [1] - The specific clients and business cooperation details are not disclosed due to confidentiality agreements [1]