国内芯片用光刻胶，70%以上依赖日本，是形势不太妙的

Core Insights - The semiconductor manufacturing process relies heavily on both semiconductor equipment and materials, with the top five materials being silicon wafers (33%), specialty gases (14%), photomasks (13%), photoresist auxiliary materials (7%), and CMP polishing materials (7%) [1] Group 1: Semiconductor Material Dependency - The overall domestic production rate of semiconductor materials is below 20%, with a significant reliance on imports, especially for advanced process materials [3] - The domestic production rate of photoresist is particularly low, estimated at only 10%, with over 70% dependence on Japan for these materials [3] Group 2: Market Share and Technology - Japan holds a dominant position in the global market for photoresist, accounting for 72% of the total share [3] - Different types of photoresist correspond to various chip processes, with Japan's market share increasing as the technology becomes more advanced [5] - Currently, China can only produce lower-end ArF photoresist, suitable for 65-40nm processes, while Japan dominates the EUV photoresist market with over 95% share [5] Group 3: Challenges in Catching Up - The lag in photoresist technology in China is attributed to the complexity of the chemical formulations and the high R&D costs associated with achieving the necessary performance metrics [7] - The semiconductor materials market is characterized by high technological content and a small market scale, making it difficult for latecomers to catch up without significant investment [9] - Japan's advancements in the semiconductor materials sector necessitate that China prepares to reduce reliance on Japanese products and improve self-sufficiency [9]