兴森科技：公司的CSP封装基板应用领域涵盖存储芯片等

Core Viewpoint - The company, Xingsen Technology, is actively expanding its market presence and customer base in the CSP packaging substrate sector, which serves various chip applications [1] Group 1: Company Overview - Xingsen Technology's CSP packaging substrates are utilized in storage chips, application processor chips, sensor chips, and RF chips, indirectly supplying domestic mobile phone manufacturers [1] - The company's Beijing subsidiary, Xinfai, produces Anylayer HDI and similar substrates primarily for high-end smartphone mainboards and sub-boards [1] Group 2: Market Strategy - The company is committed to actively pursuing market expansion and aims to increase its market share and establish benchmark customers [1]