【资本】获批！这家PCB企业上市倒计时～

Core Insights - Hongban Technology has successfully obtained the IPO registration approval and aims to list on the Shanghai Stock Exchange main board [2][4] Company Overview - Hongban Technology has established a strong customer base across multiple sectors, including consumer electronics, automotive electronics, high-end displays, and communication electronics [3] - The company is a leading manufacturer of high-density interconnect (HDI) boards, capable of producing boards with up to 26 layers, and holds a 13% market share in the smartphone HDI mainboard sector [3] - In the smartphone battery board market, Hongban Technology supplies seven of the top ten global smartphone brands, achieving a market share of 20% in 2024 [3] Financial and Operational Plans - The funds raised from the IPO will be invested in a project to produce 1.2 million square meters of high-precision circuit boards annually, enhancing HDI board production capacity and technical capabilities [4] - The company aims to optimize its financial structure, reduce financial leverage, and alleviate funding bottlenecks through this investment [4] Future Strategy - Hongban Technology plans to focus on product development in areas such as AI computing, low-orbit satellites, intelligent cockpits, optical modules, and smart driving [4] - The company intends to strengthen its core competitiveness and market share by enhancing R&D capabilities and fostering global collaborations [4]