Core Viewpoint - The company has significant investments in enterprises focusing on high bandwidth memory (HBM) technology, with ongoing developments in HBM2/2e and HBM3/3e products [1] Group 1: HBM Technology - The company's invested enterprise, Shenzhen Yuanjian Zhichun Technology Co., Ltd., is concentrating on the HBM sector, with HBM2/2e products having completed final testing and moving towards mass production and upgrades [1] - HBM3/3e products are currently in the research and development phase, having completed preliminary research and some design work [1] Group 2: Semiconductor Packaging - The company's invested enterprise, Coreis Semiconductor Technology (Dongyang) Co., Ltd., specializes in ABF substrate-related businesses, with products used for packaging high-performance chips such as CPU, GPU, AI, and automotive applications [1] - The first phase of the project has been put into production, and current progress is reported to be smooth [1] Group 3: Testing and Packaging Services - The company's invested enterprise, Hefei Xinfeng Technology Co., Ltd., focuses on the packaging and testing of memory chips, providing integrated packaging and testing services to clients [1]
中天精装：参股公司布局HBM及存储芯片封测