瑞芯微上线RK182X系列AI协处理器

Core Insights - The launch of the RK182X series by Ruixinwei positions the company in the high-performance AI co-processor market, targeting local AI inference tasks through high-speed interconnects [1][3] - The RK182X series integrates multi-core high-performance NPU, supporting local deployment of large language models (LLM) with 3B/7B parameters, enhancing capabilities in processing multi-modal data [3][4] - The innovative 3D stacking of logic chips and memory in the RK182X series allows for a theoretical bandwidth of up to 1TB/s, significantly improving local model inference throughput [3][4] Product Features - The RK182X series features built-in 2.5GB or 5GB high-bandwidth DRAM, enabling compact system design and higher bandwidth [3] - It connects to host systems via PCIe 2.0 or USB 3.0, allowing for easy integration into existing architectures without major modifications, thus lowering the entry barrier for local AI model adoption [3][4] Market Trends - The introduction of the RK182X series aligns with the rising demand for edge computing capabilities and the implementation of multi-modal large models in the industry [4] - The product's development reflects a shift from general-purpose SoCs to specialized AI co-processors among domestic chip manufacturers, indicating a trend towards more tailored solutions in the AI sector [4]