中材科技股份有限公司2025年度第三期科技创新债券发行结果公告

Core Viewpoint - The company has successfully registered and issued a short-term financing bond, indicating its ongoing efforts to secure funding for innovation and growth [1] Group 1: Bond Issuance - On April 12, 2024, the company held its annual shareholder meeting and approved a proposal to apply for the registration of issuing up to 4.8 billion RMB in short-term financing bonds [1] - On October 22, 2024, the company received a registration acceptance notice from the Trading Association, confirming the approved registration amount of 4.8 billion RMB, valid for two years from the date of the notice [1] - On November 25, 2025, the company completed the issuance of its third phase of technology innovation bonds, amounting to 500 million RMB [1]