Group 1 - Tianyu Semiconductor, a Chinese silicon carbide epitaxial wafer manufacturer, is launching an IPO from today until next Tuesday (December 2), offering 30.0705 million H-shares [1] - The IPO price is set at HKD 58 per share, aiming to raise approximately HKD 1.744 billion [1] - The share allocation consists of 10% for public offering in Hong Kong and 90% for international placement [1] Group 2 - The company plans to allocate about 62.5% of the net proceeds over the next five years for overall capacity expansion to enhance market share and product competitiveness [1] - Approximately 15.1% of the funds will be used to improve independent research and innovation capabilities to enhance product quality and shorten new product development cycles [1] - About 10.8% is earmarked for strategic investments or acquisitions to expand the customer base, enrich the product portfolio, and supplement technology for long-term development strategies [1] - Around 2.1% will be used to expand global sales and marketing networks [1] - Approximately 9.5% will be allocated for working capital and general corporate purposes [1]
天域半导体(2658.HK)今起招股 入场费2929元