兴森科技：CSP封装基板业务和北京兴斐HDI板、类载板业务与原有重要客户的合作均正常推进

Group 1 - The core viewpoint of the article is that Xingsen Technology's CSP packaging substrate business and its collaboration with key clients in Beijing Xinfai HDI boards and similar carrier boards are progressing normally, despite confidentiality agreements preventing the disclosure of specific client information [2]