长川科技：拟募资31.32亿元用于半导体设备研发项目

Core Viewpoint - The company plans to raise 3.132 billion yuan for semiconductor equipment R&D and to supplement working capital, with a total project investment of 3.840 billion yuan [1] Fundraising and Project Details - The company intends to use 2.192 billion yuan from the fundraising for the project [1] - The project will be implemented by the company and its subsidiaries, with funding allocations of 53.97% by the company, 26.96% by Changchun Suzhou, 12.87% by Changchun Harbin branch, and 6.20% by Shanghai Changchun [1] Project Implementation Considerations - Some lease terms may not cover the project implementation period, but there are agreements for lease renewals and high site substitutability, which will not cause significant adverse effects [1]